Lead Free
Flip Chip
 
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Example Full Array
With Daisy Chain		 Example Perimeter
With Daisy Chain


Flip Chips with Daisy Chain
Bumps Bumps Matrix Pitch Size (mm) Bump Material Tray Qty   TopLine Order Number   Quick View
48 12x12
Perimeter		 18mil
457µm		 6.3mm SnAgCu 25
waffle 2"		 FC48D6.3C457-DC
88 22x22
Perimeter		 8 mil
204µm		 5.08mm SnAgCu 36
waffle 2"		 FC88G5.08C204-DC
96 24x24
Perimeter		 18 mil
457µm		 12.7mm SnAgCu 25
waffle 4"		 FC96D12.7C457-DC
112 28x28
Perimeter		 6 mil
152µm		 5.08mm SnAgCu 36
waffle 2"		 FC112K5.08C152-DC
176 44x44
Perimeter		 8mil
204µm		 10.2mm SnAgCu 49
waffle 4"		 FC176G10C204-DC
220 44x66
Perimeter		 8mil
204µm		 10.2x15.2mm SnAgCu 20
waffle 4"		 FC220G10x15C204-DC
317 18x18
Full Array		 10 mil
254µm		 5.08mm SnAgCu 36
waffle 2"		 FC317G5.08C254-DC
1268 36x36
Full Array		 10 mil
254µm		 10.2mm SnAgCu 49
waffle 4"		 FC1268G10C254-DC
2853 54x54
Full Array		 10 mil
254µm		 15.2mm SnAgCu 16
waffle 4"		 FC2853G15C254-DC
5072 72x72
Full Array		 10 mil
254µm		 20.4mm SnAgCu 9
waffle 4"		 FC5072G20C254-DC
        
Flip Chips Lead Free (No Pb)bump composition 95.5Sn/3.5Ag/1.0Cu
For optional metal backing Cr/Ni/Au for eutectic die attach, add letter "M" after the pitch.
For bumpless, wire-bondable die, change "FC" to "FCN" and change "C" to "A".
Example: FCN88G5.08A204-DC

Practice PC Boards   Geometries   UBM   Bumps
Bumpless Flip Chip for Wire Bonding
        
 
Download our 24 page Flip Chip Daisy Chain Product Guide in PDF format.(1Mb)


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