| 0.4mm pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 2025 |
45x45 |
0.4mm |
21mm
|
BT |
60 |
LBGA2025T.4-DC459D |
LBGA2025T.4C-DC459D |
 |
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: LBGA2025T.5C-DC459 |
| Dummy Die: Add "D" to end of part number. Example: LBGA2025T.4-DC459D |
|
|
| 0.5mm pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 6 |
2x3 |
0.5mm |
1.5 x 1.0mm |
Si |
Reel |
CSP6E7A.5-DC023 |
CSP6E7A.5C-DC023 |
| 40 |
8x8
2-Row |
0.5mm |
5mm |
BT |
624 |
CSP40T.5-DC082 |
CSP40T.5C-DC082 |
| 56 |
10x10
2-Row |
0.5mm |
6mm |
BT |
608 |
CSP56T.5-DC102 |
CSP56T.5C-DC102 |
| 84 |
10x10
3-Row |
0.5mm |
6mm |
BT |
608 |
CSP84T.5-DC104 |
CSP84T.5C-DC104 |
| 84 |
12x12
3-Row |
0.5mm |
7mm |
BT |
476 |
CSP84T.5-DC123 |
CSP84T.5C-DC123 |
| 96 |
14x14
2-Row |
0.5mm |
8mm |
Polyimide |
360 |
fBGA96T.5-DC144 |
fBGA96T.5C-DC144 |
| 108 |
12x12
3-Row |
0.5mm |
7mm |
BT |
476 |
CSP108T.5-DC124 |
CSP108T.5C-DC124 |
| 108 |
14x14
3-Row |
0.5mm |
8mm |
BT |
360 |
CSP108T.5-DC146
Discontinued.
Use CSP132 |
CSP108T.5C-DC146
Discontinued.
Use CSP132. |
| 132 |
14x14
3-Row |
0.5mm |
8mm |
BT |
360 |
CSP132T.5-DC145 |
CSP132T.5C-DC145 |
| 228 |
22x22
3-Row |
0.5mm |
12mm |
FR4 |
198 |
LBGA228T.5-DC223
Discontinued
Use -DC222 |
LBGA228T.5C-DC223
Discontinued
Use -DC222 |
| 228 |
22x22
3-Row |
0.5mm |
12mm |
BT |
189 |
LBGA228T.5-DC222 |
LBGA228T.5C-DC222 |
| 288 |
22x22
4-Row |
0.5mm |
12mm |
BT |
189 |
LBGA288T.5-DC221 |
LBGA288T.5C-DC221 |
| 484 |
22x22
Full |
0.5mm |
12mm |
BT |
189 |
LBGA484T.5-DC229 |
LBGA484T.5C-DC229 |
| 2025 |
45x45
Full |
0.5mm |
25mm |
BT |
44 |
LBGA2025T.5-DC459D |
LBGA2025T.5C-DC459D |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: CSP56T.5C-DC102 |
| Dummy Die: Add "D" to end of part number. Example: CSP56T.5-DC102D |
|
|
| 0.60mm ~ 0.65mm pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 4 |
2x2 |
0.65mm |
1.0 x 0.5mm
|
Si |
Reel |
CSP4E7A.65-DC022 |
- |
| 2025 |
45x45
Full |
0.65mm |
32.5mm
|
BT |
24 |
LBGA2025T.65-DC459D |
LBGA2025T.65C-DC459D |
| 2500 |
50x50
Full |
0.60mm |
35mm
|
BT |
24 |
LBGA2500T.6-DC509 |
LBGA2500T.6C-DC509 |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: LBGA2025T.65C-DC459 |
| Dummy Die: Add "D" to end of part number. Example: LBGA2025T.65-DC459D |
| Top of Page |
|
|
| 0.75mm Pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 46 |
6x8
Full |
0.75mm |
6 x 7mm |
BT |
160 |
BGA46T.75-DC24 |
BGA46T.75C-DC24 |
| 48 |
6x8
Full |
0.75mm |
6 x 7mm |
BT |
480 |
BGA48T.75-ISO-6x8B |
BGA48T.75C-ISO-6x8B |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA46T.75C-DC24 |
| Dummy Die: Add "D" to end of part number. Example: BGA46T.75-DC24D |
| Top of Page |
|
|
| 0.8mm pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 36 |
6x6
Full |
0.8mm |
6 x 6mm |
BT |
608 |
BGA36T.8-DC069 |
BGA36T.8C-DC069 |
| 48 |
6x8
Full |
0.8mm |
8 x 9mm |
FR4 |
297 |
LBGA48T.8-DC689 |
LBGA48T.8C-DC689 |
| 48 |
6x8
Full |
0.8mm |
8mm |
BT |
80 |
BGA48T.8-DIE-6x8 |
- |
| 49 |
7x7
Full |
0.8mm |
7mm |
BT |
476
429 |
BGA49T.8-DC077
BGA49T.8-D |
- |
| 49 |
7x7
Full |
0.8mm |
6mm |
BT |
429 |
- |
BGA49T.8C-DC077
BGA49T.8C-ISO |
| 64 |
8x8
Full |
0.8mm |
8mm |
BT |
319 |
BGA64T.8-DC089 |
BGA64T.8C-DC089 |
| 81 |
9x9
Full |
0.8mm |
8mm |
BT |
360 |
BGA81T.8-DC099 |
BGA81T.8C-DC099 |
| 84 |
6x15
DDR2 |
0.8mm |
8x14mm |
BT |
TBA |
LBGA84T.8-DC656 |
LBGA84T.8C-DC656 |
| 84 |
6x15
DDR2 |
0.8mm |
10x12.5mm |
BT |
TBA |
LBGA84T.8-DC654 |
LBGA84T.8C-DC654 |
| 84 |
6x15
DDR2 |
0.8mm |
12x12.5mm |
BT |
TBA |
LBGA84T.8-DC655 |
LBGA84T.8C-DC655 |
| 100 |
10x10
Full |
0.8mm |
10mm |
BT |
250 |
BGA100T.8-DC109 |
BGA100T.8C-DC109 |
| 100 |
11x11
4-Row |
0.8mm |
10mm |
BT |
184 |
BGA100T.8-11x11 |
- |
| 112 |
11x11
4-Row |
0.8mm |
10mm |
FR4 |
250 |
LBGA112T.8-DC114 |
LBGA112T.8C-DC114 |
| 144 |
12x12
Full |
0.8mm |
12mm |
FR4 |
198
168 |
LBGA144T.8-DC128 |
LBGA144T.8C-DC128 |
| 144 |
13x13
4-Row |
0.8mm |
12mm |
FR4 |
168
198 |
LBGA144T.8-DC134 |
LBGA144T.8C-DC134 |
| 175 |
15x15
4-Row |
0.8mm |
13mm |
BT |
160 |
BGA175T.8 |
BGA175T.8C |
| 208 |
17x17
4-Row |
0.8mm |
15mm |
FR4
BT |
126 |
LBGA208T.8-DC170
BGA208T.8-DC170 |
LBGA208T.8C-DC170
BGA208T.8C-DC170 |
| 280 |
19x19
5-Row |
0.8mm |
17mm |
FR4 |
90 |
LBGA280T.8-DC195 |
LBGA280T.8C-DC195 |
| 532 |
26x26
7-Row |
0.8mm |
23mm |
FR4 |
60 |
LBGA532T.8-DC266 |
LBGA532TC.8-DC266 |
| 676 |
26x26
Full |
0.8mm |
23mm |
FR4 |
60 |
LBGA676T.8-DC269 |
LBGA676TC.8-DC269 |
| 2025 |
45x45
Full |
0.8mm |
40mm |
BT |
21 |
LBGA2025T.8-DC459D |
LBGA2025T.8C-DC459D |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example:BGA100T.8C-DC109 |
| Dummy Die: Add "D" to end of part number. Example: BGA100T.8-DC109D |
|
Top of Page |
|
|
|
1.0mm pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 81 |
9x9
Full |
1.0mm |
10mm |
BT |
184 |
BGA81T1.0-ISO |
BGA81T1.0C-ISO |
| 100 |
10x10
Full |
1.0mm |
11mm |
BT |
160 |
BGA100T1.0 |
- |
| 144 |
12x12
Full |
1.0mm |
13mm |
BT |
160 |
BGA144T1.0-D
LBGA144T1.0-DC128 |
LBGA144T1.0C-DC128 |
| 156 |
14x14
4-Row |
1.0mm |
15mm |
BT |
126 |
BGA156T1.0-DC140 |
BGA156T1.0C-DC140 |
| 160 |
14x14
4-Row
2x2 center |
1.0mm |
15mm |
BT |
126 |
BGA160T1.0-DC142 |
BGA160T1.0C-DC142 |
| 160 |
14x14
4-Row |
1.0mm |
15mm |
BT |
126 |
BGA160T1.0-DC147A |
BGA160T1.0C-DC147A |
| 165 |
13x15
Full |
1.0mm |
13x15mm |
BT |
136 |
BGA165T1.0-DC1115 |
BGA165T1.0C-DC1115 |
| 192 |
16x16
4-Row |
1.0mm |
17mm |
BT |
90 |
BGA192T1.0-DC160A |
BGA192T1.0C-DC160A |
| 196 |
14x14
Full |
1.0mm |
15mm |
BT |
126 |
BGA196T1.0-DC149A |
BGA196T1.0C-DC149A |
| 208 |
16x16
4-Row
4x4 center |
1.0mm |
17mm |
BT |
90 |
BGA208T1.0-DC164A |
BGA208T1.0C-DC164A |
| 209 |
11x19
Full |
1.0mm |
14 x 22mm |
FR4 |
84 |
LBGA209T1.0-DC1119 |
LBGA209T1.0C-DC1119 |
| 256 |
16x16
Full |
1.0mm |
17mm |
BT |
90 |
BGA256T1.0-DC169A |
BGA256T1.0C-DC169A |
| 288 |
22x22
4-Row |
1.0mm |
23mm |
BT |
60 |
BGA288T1.0-DC221 |
BGA288T1.0C-DC221 |
| 324 |
22x22
4-Row
6x6 center |
1.0mm |
23mm |
BT |
60 |
BGA324T1.0-DC224 |
BGA324T1.0C-DC224 |
384
(388) |
26x26
4-Row
6x6 center |
1.0mm |
27mm |
FR4 |
40 |
LBGA384T1.0-DC261 |
LBGA384T1.0C-DC261 |
388
|
26x26
4-Row
6x6 center |
1.0mm |
27mm |
BT |
40 |
BGA388T1.0-DC264
BGA388T1.0-D |
BGA388T1.0C-DC264 |
| 400 |
20x20
Full |
1.0mm |
21mm |
BT |
60 |
LBGA400T1.0-DC209 |
LBGA400T1.0C-DC209 |
| 484 |
22x22
Full |
1.0mm |
23mm |
FR4 |
60 |
LBGA484T1.0-DC229A |
LBGA484T1.0C-DC229A |
| 672 |
26x26
Full |
1.0mm |
27mm |
FR4 |
40 |
eBGA672T1.0-D268D
LBGA672T1.0-DC268 |
eBGA672T1.0C-D268D
LBGA672T1.0C-DC268 |
676
|
26x26
Full |
1.0mm |
27mm |
BT |
40 |
BGA676T1.0-DC269 |
BGA676T1.0C-DC269 |
| 900 |
30x30
Full |
1.0mm |
31mm |
FR4 |
27 |
eBGA900T1.0-D309D
LBGA900T1.0-DC309 |
eBGA900T1.0C-D309D
LBGA900T1.0C
DC309 |
| 1156 |
34x34
Full |
1.0mm |
35mm |
BT |
24 |
BGA1156T1.0-DC349 |
BGA1156T1.0C-DC349 |
| 1600 |
40x40
Full |
1.0mm |
42.5mm |
FR4 |
12 |
eBGA1600T1.0-D409D
LBGA1600T1.0-DC409 |
eBGA1600T1.0C-D409D
LBGA1600T1.0C-DC409 |
| 1936 |
44x44
Full |
1.0mm |
45mm |
FR4 |
12 |
eBGA1936T1.0-D449D
LBGA1936T1.0-DC449 |
eBGA1936T1.0C-D449D
LBGA1936T1.0C-DC449 |
| 10,000 |
100x100
Full |
1.0mm |
114mm |
FR4 |
4 |
LBGA10000T1.0-BUS |
LBGA10000T1.0C-BUS |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA256T1.0C-DC169A |
| Dummy Die: Add "D" to end of part number. Example: BGA256T1.0-DC169AD |
| Top of Page |
|
|
| 1.27mm Pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 119 |
7x17
Full |
1.27mm |
14 x 22mm |
BT |
84 |
BGA119T1.27-DIE |
- |
| 208 |
17x17
4-Row |
1.27mm |
23mm |
BT |
60 |
BGA208T1.27-DC170
BGA208T1.27-DC171 |
BGA208T1.27C-DC170
BGA208T1.27C-DC171 |
| 217 |
17x17
4-Row
3x3 center |
1.27mm |
23mm |
BT |
60 |
BGA217T1.27-DC172
BGA217T1.27-DC174 |
BGA217T1.27C-DC172
BGA217T1.27C-DC174 |
| 256 |
20x20
4-Row |
1.27mm |
27mm |
BT |
40 |
BGA256T1.27-DC200 |
BGA256T1.27C-DC200 |
| 256 |
16x16
Full |
1.27mm |
27mm |
FR4 |
40 |
LBGA256T1.27-DC61 |
LBGA256T1.27C-DC61 |
| 272 |
20x20
4-Row
4x4 center |
1.27mm |
27mm |
BT |
40 |
BGA272T1.27-DC202 |
BGA272T1.27C-DC202 |
| 292 |
20x20
4-Row
6x6 center |
1.27mm |
27mm |
BT |
40 |
BGA292T1.27 |
BGA292T1.27C |
| 313 |
25x25
Staggered |
1.27mm |
35mm |
BT |
24 |
BGA313T1.27 |
BGA313T1.27C |
| 328 |
20x20
5-Row
4x4 center |
1.27mm |
27mm |
BT |
40 |
BGA328T1.27 |
- |
| 329 |
23x23
4-Row
5x5 center |
1.27mm |
31mm |
BT |
27 |
BGA329T1.27-ISO |
- |
| 352 |
26x26
4-Row |
1.27mm |
35mm |
BT |
24 |
BGA352T1.27-DC70 |
BGA352T1.27C-DC70 |
| 357 |
19x19
Full |
1.27mm |
25mm |
FR4 |
44 |
LBGA357T1.27-DC73 |
LBGA357T1.27C-DC73 |
| 385 |
23x23
5-Row
5x5 center |
1.27mm |
31mm |
BT |
27 |
BGA385T1.27 |
- |
| 388 |
26x26
4-Row
6x6 center |
1.27mm |
35mm |
BT |
24 |
BGA388T1.27-DC72
BGA388T1.27-DC265 |
BGA388T1.27C-DC72
BGA388T1.27C-DC265 |
| 436 |
26x26
5-Row
4x4 center |
1.27mm |
35mm |
BT |
24 |
BGA436T1.27 |
- |
| 1225 |
35x35
Full |
1.27mm |
45mm |
FR4 |
12 |
eBGA1225T1.27-D359D
LBGA1225T1.27-DC359 |
eBGA1225T1.27C-D359D
LBGA1225T1.27C-DC359 |
| 6,400 |
80x80
Full |
1.27mm |
114mm |
FR4 |
4 |
- |
LBGA6400T1.27F-BUS
LBGA6400T1.27C-BUS |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA256T1.27C-DC200 |
| Dummy Die: Add "D" to end of part number. Example: BGA256T1.27-DC200D |
| Top of Page |
|
|
| SBGA - Thermally Enhanced 1.27mm Pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 256 |
20x20
4-Row |
1.27mm |
27mm |
BT |
40 |
SBGA256T1.27-DC200 |
SBGA256T1.27C-DC200 |
| 304 |
23x23
4-Row |
1.27mm |
31mm |
BT |
27 |
SBGA304T1.27-DC230 |
SBGA304T1.27C-DC230 |
| 352 |
26x26
4-Row |
1.27mm |
35mm |
BT |
24 |
SBGA352T1.27-DC70 |
SBGA352T1.27C-DC70 |
| 432 |
31x31
4-Row |
1.27mm |
40mm |
BT |
24 |
SBGA432T1.27-DC314 |
SBGA432T1.27C-DC314 |
| 480 |
29x29
5-Row |
1.27mm |
37.5mm |
BT |
21 |
SBGA480T1.27-ISO |
SBGA480T1.27C-ISO |
| 560 |
33x33
5-Row |
1.27mm |
42.5mm |
BT |
12 |
SBGA560T1.27-DC87 |
SBGA560T1.27C-DC87 |
| 600 |
35x35
5-Row |
1.27mm |
45mm |
BT |
12 |
SBGA600T1.27-D
SBGA600T1.27-DC355 |
SBGA600T1.27C-DC355 |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: SBGA256T1.27C-DC200 |
| Dummy Die: Add "D" to end of part number. Example: SBGA256T1.27-DC200D |
| Top of Page |
|
|
|
PBGA - 1.5mm pitch |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Substrate |
Tray Qty |
SnPb
Standard |
SnAgCu
Lead Free - RoHS |
| 169 |
13x13
Full |
1.5mm |
23mm |
BT |
60 |
BGA169T1.5-DC10 |
BGA169T1.5C-DC10 |
| 225 |
15x15
Full |
1.5mm |
27mm |
BT |
40 |
BGA225T1.5-DC15 |
BGA225T1.5C-DC15 |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: BGA169T1.5C-DC10 |
| Dummy Die: Add "D" to end of part number. Example: BGA169T1.5-DC10D |
| Top of Page |
|
|
|
CBGA - Ceramic Ball Grid Standard=Sn10=Hi Temp, L=Sn62=Low Temp, C=Sn96.5/Ag3.0/Cu0.5 |
| Balls |
Ball Matrix |
Pitch |
Size (mm) |
Tray Qty |
Bare Substrate
Without Balls
For CCGA |
Hi-Temp SnPb
Low-Temp SnPb |
Lead Free
Pb-Free (RoHS) |
| 121 |
11x11
Full |
1.27mm |
15mm |
119/126 |
CLGA121T1.27A-DC5
Pt-Ag95 |
CBGA121T1.27-DC5
Sn10/Pb90
CBGA121T1.27L-DC5
Sn62/Pb36/Ag2.0 |
CBGA121T1.27C-DC5
Sn96.5/Ag3.0/Cu0.5 |
| 196 |
14x14
Full |
1.27mm |
18.5mm |
84 |
CLGA196T1.27A-DC11
Pt/Ag95 |
CBGA196T1.27-DC11
Sn10/Pb90
CBGA196T1.27L-DC11
Sn62/Pb36/Ag2.0 |
CBGA196T1.27C-DC11
Sn96.5/Ag3.0/Cu0.5 |
| 256 |
16x16
Full |
1.27mm |
21mm |
60 |
CLGA256T1.27A-DC61
Pt/Ag95 |
CBGA256T1.27-DC61
Sn10/Pb90
CBGA256T1.27L-DC61
Sn62/Pb36/Ag2.0 |
CBGA256T1.27C-DC61
Sn96.5/Ag3.0/Cu0.5 |
| 304 |
16x19
Full |
1.27mm |
21 x 25 |
55 |
CLGA304T1.27A-DC63
Pt/Ag95 |
CBGA304T1.27-DC63
Sn10/Pb90
CBGA304T1.27L-DC63
Sn62/Pb36/Ag2.0 |
CBGA304T1.27C-DC63
Sn96.5/Ag3.0/Cu0.5 |
| 361 |
19x19
Full |
1.27mm |
25mm |
44 |
CLGA361T1.27A-DC71
Pt/Ag95 |
CBGA361T1.27-DC71
Sn10/Pb90
CBGA361T1.27L-DC71
Sn62/Pb36/Ag2.0 |
CBGA361T1.27C-DC71
Sn96.5/Ag3.0/Cu0.5 |
| 400 |
20x20
Full |
1.27mm |
27mm |
40 |
CLGA400T1.27A-DC21
Pt/Ag95 |
CBGA400T1.27-DC21
Sn10/Pb90
CBGA400T1.27L-DC21
Sn62/Pb36/Ag2.0 |
CBGA400T1.27C-DC21
Sn96.5/Ag3.0/Cu0.5 |
| 625 |
25x25
Full |
1.27mm |
32.5mm |
24 |
CLGA625T1.27A-DC81
Pt/Ag95 |
CBGA625T1.27-DC81
Sn10/Pb90 |
CBGA625T1.27C-DC81
Sn96.5/Ag3.0/Cu0.5 |
| 1089 |
33x33
Full |
1.27mm |
42.5mm |
12 |
CLGA1089T1.27A-DC339
Pt/Ag95 |
CBGA1089T1.27-DC339
Sn10/Pb90 |
CBGA1089T1.27C-DC339
Sn96.5/Ag3.0/Cu0.5 |
|
| For SnAgCu Lead Free solder balls, add "C" after the pitch. Example: CBGA256T1.27C-DC61 |
| Dummy Die: Add "D" to end of part number. Example: CBGA256T1.27-DC61D |
|
CBGA Substrate: 1.0mm (40mils) thick. Composition 96% Alumina, 4% Talc, 1600°C. Fired CTE 6.7 x 10-6/°C |
|
Large Size CBGA Delamination CTE mismatch warning. |
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| Notes About Substrates |
| BT Versus FR4 |
| Flex Polyimide Versus BT |
